Hi ,

I  experienced very poor adhesion of SU-8 on Si-Nitride, it is not very
strong
on glass and Si as well.
Concerning the fact that AP300 deposits a very thin layer of  Ti-Oxide,
I deposited
10 A of Ti by evaporation onto SiN and glass. This layer greatly enhanced
the adhesion of SU-8.
Anyway, a longer PEB at lower temperature is very good to avoid
excessive stress.
Some structures I bake at 60 deg C for 12 hours, then switch off the
hotplate and allow it
to cool down slowly. This is mandatory if the development process takes
some hours.

Best regards
Peter Svasek

--
Vienna University of Technology
Institute of Sensor and Actuator Systems
Gusshausstrasse 27-29/366
A-1040 Vienna
Austria


Brubaker Chad schrieb:

>There is an adhesion promoter available for SU-8:
>
>AP300 from Silicon Resources (siliconresources.com).