durusmail: mems-talk: Re: Gold/silicon adhesion in KOH/TMAH
Re: Gold/silicon adhesion in KOH/TMAH
1998-05-28
1998-05-29
Re: Gold/silicon adhesion in KOH/TMAH
Jonathan Bernstein
1998-05-28
Try Ti/Pt/Au, 50 nm / 100 nm / 500 nm Au.  The Ti will be somewhat attacked by
KOH.

Let me know if it works.

Jon




At 08:54 AM 5/27/98 +0100, you wrote:

>Hi,

>I am a PhD student working on a new electroless etch stop technique.

>Could you help me with the following problem:

>What kind of metal process do I need to get a gold layer on silicon

>which survives KOH or TMAH at high temperatures. We have tried

>evaporated Au/Cr but that comes of after a few hours?

>If you can help me please e-mail: c.m.a.ashruf@et.tudelft.nl

>Thanks

>

>

>

>

>

Jonathan Bernstein

MEMS Technology Center

Draper Labs, MS 37

555 Technology Square

Cambridge, MA 02139 USA


jbernstein@draper.com

Tel. (617) 258-2513

Fax  (617) 258-4238


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