Hi,
I am trying to build a MEMS device, which comprise a 2-arm in-plane mechanical
cantilever made of SU-8 2050.  After patterning the SU-8 2050 cantilever and
prior to developing the photoresist, I will evaporate about 80nm gold film on
the SU-8 2050 cantilever.  The gold film is to form a bridge between the edge of
the cantilever and another SU-8 post.

The idea is to use the cantilever to rupture the gold film.  I suppose that the
rupture mechanism is using the poor adhesion strength between gold & SU-8
(4.8MPa) or breaking strength in the suspended gold bridge.

Can anyone advise me if this method can be used to break or rupture the gold
film?

Mr. Jeffrey Mun Pun YUE
Division of Bioengineering
Block E3, #05-18, Nanobioanalytics Lab
9 Engineering Drive 1
National University of Singapore
Singapore 117576
Tel: (65) 65165985, Fax: (65) 68723069
E-mail:  g0500396@nus.edu.sg