I'd add: d) Radiative heating by exposure to the molten evaporate - high in e beam and thermal evaporation, but of course non-existant for sputtering. -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of MT Klaus Beschorner Sent: Monday, March 05, 2007 5:51 AM To: mems-talk@memsnet.org Subject: [mems-talk] Thermal issues in metal deposition To contribute to an already heated :-) discussion: Substrate heating in metal deposition has three main contributors: a) heat of condensation of the metal atoms b) kinetic energy of arriving atoms c) resistive heating by secondary electrons In more detail: a) is entirely material dependant, and is usually between 1(Cd) and 9(W) eV/atom b) depends on the deposition process used, usually <1eV/atom for evaporation, 2-10eV for sputtering, up to 50eV for iPVD. c) usually low for evaporation, can be very high in sputtering sources without proper magnetic confinement of secondary electrons emitted from the target.