Hi,

I am currently fabricating AFM cantilevers out of SOI wafers. The
biggest problem in the process is still the through wafer etch with
KOH 22.5%, 55C that destroys the resulting fragile membranes of SiO2
(1um) just before the release (breaking). Does anybody know of tricks
for setups etc. how to avoid membrane failure in a liquid KOH bath?
Membranes are about 3x1.5mm each.

Thanks!
Benedikt Zeyen.

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Benedikt Zeyen
bzeyen@umail.ucsb.edu