Hi,
I have had problem trying to cut or scribe glass wafers with a diamond scriber
in order to dice a glass wafer with straight lines. Can anyone advise me how I
can cut or bore holes in glass slides or glass wafers?  Is using patterned mask
followed by HF definitely the only method?  What concentration of HF should be
used?

Mr. Jeffrey Mun Pun YUE
余文彬
Division of Bioengineering
E3A-07-02, Nanobioanalytics Lab
7 Engineering Drive 1
National University of Singapore
Singapore 117574
Tel: (65) 65166482, Fax: (65) 68723069
E-mail:  g0500396@nus.edu.sg