Hello Anh,

Depending on your temperature window, you have a variety of choices for
eutectic bonding for MEMS: AuSi, AuSn, AuIn, AuGe being some of the
commonly used eutectic systems)
Here are a couple of papers that will give you a headstart on the
various eutectic bonds;

ENCAPSULATION OF VACUUM SENSORS IN A WAFER LEVEL PACKAGE USING A
GOLDSILICON EUTECTIC and other papers from Najafi's group at U Michigan
are good refs for AuSi eutectic bonds

Kim et al, Application of Au-Sn Eutectic Bonding in Hermetic RF MEMS
Wafer Level Packaging, 9th Int'l Symposium on Advanced Packaging
Materials, 2004

Adhesive wafer bonding-[Journal of Applied Physics 99, 031101 (2006)]
(This is a review paper on Adhesive bonding but the first few sections
discuss and refers to various eutectic and metal bonds)

Thanks

Sumant Sood
Bonder Applications
SUSS MicroTec Inc.

-----Original Message-----
From: mems-talk-bounces@memsnet.org
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anh_tuan.tham@pcm.endress.com
Sent: Friday, January 04, 2008 1:59 AM
To: General MEMS discussion
Subject: RE: [mems-talk] Need recommendation on good book on bonding.

Hi Brad,

I'm interested in Eutectic Bonding for MEMS. Can you be so kind giving
me
some good refs on this subject.