Steven, This is a classic problem with retained moisture at the edge of the open areas. Cure with normal resists was vacuum vapor prime. This removed all moisture then sealed the surface against any return. Result no problems with future processing even at the edges. The process is very robust and can survive any sort of exposure after priming. If you want we can run free samples. Bill Moffat, CEO Yield Engineering Systems, Inc. 203-A Lawrence Drive, Livermore, CA 94551-5152 (925) 373-8353 bmoffat@yieldengineering.com www.yieldengineering.com -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of Steven Yang Sent: Monday, January 07, 2008 11:56 PM To: mems-talk Subject: [mems-talk] SU-8 2050 Cracking and Peeling off Hi, all These days got a lot of problem in SU-8 microchannel fabrication. I tried to fabricate microchannel using SU-8 2050, after settle down some alignment problem, I still cannot got the good sample while with the SU-8 layer kept cracking or peeling off from substrate. Here I gave the entire process I went through, could anyone give your suggestion for my case. Sub: square Si, with 2um PECVD SiO2 layer, and patterned EB evaporated Cr/Au 150nm on it. 1) Hotplate: 150C to dehydrate 15mins 2) Spin coat SU-8 2050: 500/100/5s, and then 4000/1000/45s, suppose to be 40um thick. 3) Softbake: 65C for 3mins, and cool down to room temperature, then 95C for 30mins. 4) Exposure: MA8 CI1 7mw/cm2 35s 5) PEB: 65C for 3mins then raise the temperature up to 95C and stay for 10mins. 6) Develope: SU-8 developer for 4mins. Results: part of SU-8 pattern starts to peel off from sub after 1-2 mins rinse in developer, especially at the regions near microchannel open or the edge of the Sub. I am not doubting about the Exposure and PEB steps causing such result. Could anyone advise me what dose and PEB process you adopted for a sucessful SU-8 pattern.