SU-8 does not tend to stick to glass and quartz (and thus, SiO2) very well at all. Dehydration bakes and HMDS treatments seem to have little effect. The only thing I've found to get reliable adhesion of SU-8 on glass, quartz, SiO2, etc. is AP 300 from Silicon Resources in Chandler, AZ (www.siliconresources.com). Best Regards, Chad Brubaker EV Group invent * innovate * implement Senior Process Engineer - Technology - Tel: 480.727.9635, Fax: 480.727.9700 e-mail: c.brubaker@EVGroup.com, www.EVGroup.com -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of Steven Yang Sent: Friday, January 11, 2008 2:10 AM To: mems-talk Subject: [mems-talk] How to improve SU-8 adhesion? Hi, all Asked some questions on SU-8 2050 several days ago, still stuck on it now. The problem is the peeling off at some SU-8 2050 microchannel edge.(SU-8 2050 on PECVD SiO2). Without SiO2 layer, the situation will get better with seldom cracking and peeling off. However, on PECVD SiO2 it always turns out this problem more or less. I have increased the temperature and time for dehrydration at 180C for 30mins. and exposured for 40s at 7mW/cm2, PEB at 65C, 95C for 5 and 15 mins respectively (Same as softbake). No much different. If there is no any further solution based on recipe modification, will the HMDS get the thing better? If so, could anyone give some suggestion on the HMDS spin procedure? below is what I plan to do. 1) dehydrate at 150C for 15mins 2) spin HMDS at 7500rpm for 35s 3) dehydrate at 150C for another 15mins 4) spin SU-8 2050 at 4000rpm for 45s Any suggestion? Thanks a lot! Steven