I have 200-400 nm thick SiO2 thin film grown using PECVD-RIE machine. Now I need to etch the SiO2 thin film at the same machine to get patterned SiO2 hard mask. I only have CF4 and SF6 gases in the machine. Could I get some advices on dry etching SiO2 to get patterned hard mask. Also I need what kind pf PR I should use on top of SiO2. Sincerely Yours Alim Polat, PhD student ITN, Linkoping University Sweden