I am trying to obtain a good undercut profile of the photoresist to get a good liftoff. The thickness of the photoresist needs to be about 6~7microns. The deposited material is about 3microns thick. Soaking in chlorobenzene for 30 minutes was not enough to give a good enough undercut profile for a good liftoff. Is there anyone who can help me with this? Is there an alternative to this process?