Dear all, I am fabricating SU8 molds on silicon wafer. The humidity is not well controlled in our fab. When it is below 20% percent, the adhesion is good. However, I find the effect of dehydration bake is very limited when the humidity is above 30%. I think the moisture condensed to the surface immediately after I take the wafer off the hotplate. I don't know what's the humidity when other people fabricating the SU8 mold. I am wondering whether anybody have any success in such humidity. I am thinking of using AP300 as adhesion promoter between silicon wafer and SU-8 molds. I see we had a lot of discussion here before. Could someone give me a standard operation procedure to start with? Thanks! Regards, Peng