Hi Walter and everybody,

I have thought that the standart process for ITO deposition was DC
sputtering. If ITO is not an issulator, why do you use RF magnetron?

We usually ITO-coated glass from a German company (PGO) with the next
properties:
- ≤Ω/sq =10
-typ.≤Ω/sq= 8,5
-typ.ITO-film thickness = 180 nm
-Substrate-thicknesses = 0.7mm

What kind of ITO sputtering do you think they use?

For example, for a 10cm2 ITO-coated glass, what amount of ITO target do
you need?
-About the pressure, what do you main with low 7 range (7 times less tha
atmospheric pressure? How long do you have to maintain the vaccum? (In
order to work out the energy consumption in getting this low pressure)
-What is the power consumption of the RF source and how long you have to
connect it?
-10 micron of Argon, do you mean the flow or the volume? it is possible
to work out approximately the stoichiometry and so the O2 consumption?

Thank for your useful information.

Kind regards,

Rafael García-Valverde

> Greetings Rafael,
>
> The basic process uses RF magnetron sputtering,preferable in a tool
that is
> cryo pumped to start.
> We at Elume pump down to low 7 range.
> We backfill with argon to approx 10 micron.
> The tool we have for ITO is in auto mode however you can get good films
> using manual mode.
> We also use O2 in our process.
> ITO stoichiometry needs experimenting.