Hi all

I am trying to find a way to pattern Au electrode on PDMS, while keep
the PDMS surface still sticky to be applied later on Si surface as the
cover to seal the microchannel.

I searched and found someone mentioned a Au transfer from Si to PDMS
methode. However, I firstly doubt that the Au can be patterned on Si
with easy transfer property or not? Because the pattern must go
through photoresist removel process which will aslo attack the metal
that not adhered solidly. Secondly, I also doubt the PDMS will stick
on Si without easy to peal off?

So, except this method, is it possible to pattern Au electrode on PDMS
while still keep the PDMS surface sticky enough to make a solid
bonding with silicon substrate? Any suggestion?

Thanks and regards,
Yuming