Hi,

I have a problem regarding plating copper onto hard-baked SU-8 3050
layer (SU-8 3000 series by MicroChem).
So far, the following experiments have been conducted:

1. Electroplating of Cu on SU-8. Tried with/without surface treatments
(i.e. plasma, mechnical roughening, permaganate). In all cases,
adhesion was poor.

2. Sputtering (PVD) of 0.5 um Cu on SU-8. Very poor adhesion, failed
in tape test (all copper was left on tape).

3. Sputtering of 0.5 um Cu on Ti adhesion layer on SU-8. Same result as 2.

Does anyone here have experience of plating metal on hard-baked SU-8
with good adhesion results?  If so, I would be glad to know the
technique used and the obtained results as well.


Thank You

John Lee