I am trying to figure out how many applications are being used for MEMS
device encapsulation. We are experimenting with a new system that can print
from a CAD file a variety of materials or adhesives that might require a UV
cure or heat and pressure to complete the sealing proceedure. This coupled
the ability to pick and place both the substrate and the lid to be sealed to
within 2 microns accuracy for xy and theta might be useful for MEMS devices.
Please let me know what special requirements or materials would be used for
this type of processing. Bob Henderson