Hi guys, I was wondering if anyone has had similar problem before and has come up with a solution. I've had a lot of trouble trying to deposit and pattern a 100nm thick a-Si layer onto fused quartz substrate. I tried liftoff and have been struggling trying to either it to stick to the substrate. I tried piranha clean, RCA clean, HF dip, as well as having a thin (200nm) CVD SiO2 first before Si deposition. Each time the film washed away with 1165. For the lithography step, I've been using an established bi-layer process with PMGI SF11 under AZ4110 and made certain that no resist remained in open areas by overexposing/overdeveloping/over-O2 descuming. For the a-Si deposition, I've attempted both a high density plasma, SiH4-based 50C process and e-beam evaporation. I'm going to try etching next. Any input will be greatly appreciated. Trent