Hi, I am working on deposition of Ni on electroplated Cu. The Ni, I have deposited, has very poor adhesion to electroplated Cu and peels off during the Cu seed layer etch in Perchloric Acid [HClO4]and Ce (NH4)2(NO3)6 solution. The Ni is deposited by evaporation. I would like to know: 1. What cleaning and drying step I should perform before evaporation to improve adhesion ?I only remove the copper oxide in 10% nitric acid before Ni deposition. 2. The effect of chamber pressure and rate of evaporation on Ni adhesion ? and 3. Will an intermediate layer of Cr ( ca. 5 - 10 nm) help ? I hope someone can help me on this ! cheers ! Bilal TKK, Finland