Hi Balaji, Thanks. Do you think if applying some soft material on the substrates of both samples can help in this case? Lin On Tue, Sep 2, 2008 at 11:23 PM, Balajiwrote: > Hello Lin > > You could try to use a graphite or a metal plate of say 2 inch dia and 2mm > thick. This type of arrangement is there in EVG bonding machine. > > Balaji > > On Wed, Sep 3, 2008 at 1:28 AM, Lin Yu wrote: > >> Hello all, >> >> I was doing some research of bonding two initially aligned Si pieces. >> A homemade thermal bonder has been used, which can provide force >> and heat the samples. However, due to the shear force generated by >> the bonder head on the samples, the initial alignment was broken >> during the bonding. Is there any way that I can reduce the shear force >> to avoid breaking the alignment? Any suggestion is appreciated.