Dear all,

I'm having a problem with the negative resist developing. I'm using the same
process as always, but from 2 months ago I am having a problem of resist peeling
when  developing. I mean, the resist is completely stocked to the substrate, but
it seems that a little upper layer of resist goes out forming some wires of
resist. These wires during the development process can stick to other
substrates. I have checked the softbaking temperature, the spinner, the exposure
machine and different lots of resist and developer and I didn't find any
solution.

The resist I am using is SC from Fujifilm (5 microns layer).

Could anyone tell me what I can try?

Best regards,

Xabier Crespo
Fagor Electrónica, Koop. E.
Bº San Andrés, s/n - P.O. Box 33
20500 Arrasate-Mondragón
Gipuzkoa  (Spain)
Tel.  +34 943 712526
Fax. +34 943 712897
E-mail: Jcrespo@fagorelectronica.es 
Web site: www.fagorelectronica.com