Can you etch through the wafer from the backside? 2008/9/19, Shaikh, Fayaz A: > Hi, > > I have a Al-1mic (M2), SiO2 - 2mic (D1), and Al-1mic (M2) stack on a silicon > wafer. I have to etch a 100 mic x 200 mic slot through wafer. We have ICP, > RIE, AOE tools in our lab for oxide, si, metal etch. I can not use metal > mask. I tried using a thick resist of up to 10mic and etched through the > stack and I am seeing micro masking. I am not sure through if this micro > masking will be a problem if I continue to silicon etch! But are there any > suggestion where I can avoid the micro-masking? Most likely it is being > introduced during oxide etch which is penetrating O2 or Fl into M2 layer. > > Please let me know if you guys have any suggestions. Email to me at > fayazs@gatech.edu > > Fayaz Best regards, Yours sincerely Fei Wang ______________ Postdoctoral researcher, Dr MIC - Department of Micro and Nanotechnology Technical University of Denmark (DTU) Building 344, 1st floor, Room no. 130 DK-2800, Kgs. Lyngby Denmark Tel: +45 4525 6311 Fax: +45 4588 7762 Email: fei.wang@nanotech.dtu.dk http://www.nanotech.dtu.dk