Dear all,

     We etch sillicon with 100:1 HF firstly (use 5 minutes assure all native
silicon oxide be all removed),  then put silicon into Pad Etches (Pad Etches are
particularly suited for etching unusually thick or dense passivation
layers,usually Thermal Oxide or Phosphorous Doped Passivation Oxide  .And main
contents are NH4F and Acetic acid).

Can this fresh sillicon grow silicon oxide in Pad Etches? For excample  because
of reversible reaction?

Thanks!

karen