Hi Fei, Many thanks for your reply. Actually I have a patterned a nitride mask of comb fingers on silicon which is suspended by anchors bonded to glass. I am trying to etch the bulk silicon down by DRIE etch using the nitride mask. I experience the etch lag due microloading effect since the comb finger sizes are smaller than other features. Since the wafers are already bonded, I cannot coat any metals or ITO on the glass side exposed to plasma. I am trying to find out if there are any other ways to handle this problem by changing the recipes. With regards, Prasanna On Mon, Jan 5, 2009 at 12:54 PM, Fei Wangwrote: > Hi Srini, > > I am not very sure about your problem. Are you going to etch down the > bulk silicon for the comb structure with a pattern mask? Or, you have > already get the comb structure but want to thinner it? If you are not > able to depositing ITO for the mask, you may try some metals such as, > Al, Cr. > > Good luck! > Fei