Dear James Paul Grant, For any good liftoff the ratio of PR to the metal should be 2.5:1 And physical evaporating equipment like sputter should be considered for depositing as it forms conformal layers. With E beam evaporators planar layers will be formed and its hard to make a liftoff with such a small ratio 1.3 : 1 Kallempudi Sreenivasa Saravan PhD student, Electronics Engineering