Hi all,

I would like to know if anyone has a procedure for developing a lift-off
recipe for 3000 PY and patterning with 1813 photoresists using conventional
lithography techniques.  The datasheets usually specify a given soft and
hard bake temperature and duration as well as spin speed and duration of
spinning for a given resist but I would like to know how to verify the
exposure and developing times.  Is there any procedure out there thay may
apply to transparent substrates too?  Maybe there are some patterns that are
specifically used for this and some features that can be tracked under the
microscope to verify if there is over or under development or over or under
exposure.  How does one discern the over development from over exposure
....etc.


EVELYN BENABE
Graduate Research Assistant
RF Microsystems Research Group
University of South Florida
4202 East Fowler Avenue
Tampa, FL 33620
Office: ENB 412
Office Phone: (813)-974-4851
Email: benabe@mail.usf.edu