Hi everyone,

I am going to anodically bond si to glass. There is a 53 um thick square
membrane with side 1.6 mm in the middle of si chip. Also, there is a 10 um
cavity and a gold electrode on the back of si membrane that forms a capacitor
when bonding to a glass (Pyrex) with similar gold electrode.
I was wondering if electrostatic force during bonding process pulls in membrane
toward glass (as there is just a small 10 um gap between them). If so, does gold
electorde on membrane still stick on the electrode of glass after the process.
If not, does the membrane return to the original position after the process. How
is the difference of effect between bonding in vacuum or air.

Any help will be highly appreciated.

Thanks,
Reza Rashidi