Hello all,

I have recently come across some papers describing planarization of
SU8 by chemical-mechanical polishing (CMP).  Are there other materials
that can be used for this process to planarize up to 100µm of
topography and act as a passivation for a device?

Thanks in advance.

Brad Cantos
brad.cantos@holage.com
http://holage.com

LinkedIn: http://www.linkedin.com/in/bradcantos