Hi all,Few weeks ago someone else asked about glass cracking after anodic
bonding. I am having the same problem but form a different reasons. My
cracks seem to nucleate form the holes I drilled using a diamond drill bit
(3/4mm) attached to a Dremmel. The cracks start after I start cooling down
the device. I ramp down the temperature as well. My bonding conditions are
500C and 700V. I am using a spring loaded gold pin as the top electrode. How
can I avoid these cracks?

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Mehmet Aykol
University of Southern California
EE - Electrophysics
Phone: (213) 821-4090