Is the post-development bake done after development supposed to be done
after or before descum.  I am doing a descum of 1813 resist before BST
etching in BOE solution.  I am planning on doing a post-development bake to
make the resist more resistant to the BOE but I am not sure if I should do
it right before the actual etch or before the descum.  Right now m process
is as follows

1. Resist coating
2. Soft-bake and exposure
3. Development
4. Post-development bake
5. Descum
6. BST etch


Thanks to all,

Evelyn

--
EVELYN BENABE
Graduate Research Assistant
RF Microsystems Research Group
University of South Florida
4202 East Fowler Avenue
Tampa, FL 33620
Office: ENB 412
Office Phone: (813)-974-4851
Email: benabe@mail.usf.edu