Hello,

Is there a way to chemically etch and thin down <100> oriented silicon
handle layer of a SOI wafer from 700 microns to 200 microns without
affecting the top silicon? I tried polishing, but our machine is not flat
leading to thinning down on side much more than other even after very good
alignment with respect to center of polishing lap. I need to cleave the
sample after thinning down.

--
Ananth Krishnan
Texas, USA