Hi All,

We have 8" thinned wafers tape bonded to glass carriers (without notch),
so a little thicker and heavier than a normal 8" wafer, 25 to a crystalpak.
The crystalpak cassette has a 1/4" (6.25mm) spacing from the centre to
centre of each slot.
We have observed some contamination on the mems due to manual handling
so we are having a rethink.
We have tried some mechanical pistol tweezers but have had also seen
cracks the glass carrier caused by the locating tweezer pins.

Does anyone have any generic wafer handling guidelines that they would
like to share?

Does anyone have any recommendations for a vacuum wand body/tip that
will fit down between the wafers for manual load/unload?

thanks and regards,

    Matt