Hi,

I am new to micromachining technology. I want to make air bridge structure
using Polyimide about 5 micron. Now some one told me that I can use RIE and
plasma etching for it. But I do not know, during etching process how to
protect the metal structure above the Polyimide sacrificial layer?

Also I have done some literature review and I come to know that trenches for
the sacrificial layer may be open before fabricating your device structure.
But I am not able to understand that if I will do the metal deposition for
my device structure after opening the trenches then trenches my also be
filled with the metal (say Ti and Au) then how to remove these metals from
the trenches?

Please suggest any process which can help me during the etching of the
sacrificial layer.

Thanks
Mukesh