durusmail: mems-talk: DRIE
DRIE
DRIE
Miyakawa, Natsuki
2009-11-05
Dear all,

After DRIE-etiching of silicon I found that the bottom surface of the etched
area was quite rough (roughness >30nm for etching depth 70µm, roughness
increases with increasing etching depth) . Is there any method to make the
surface smooth (<10nm)?

Thanks!

Regards

Natsuki
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