I would like to partially develop a 5-10 um-thick Su-8 film on a Si wafer.
After the partial development, I am going to deposit a thin metal layer and
perform a liftoff by finishing the Su-8 development. So far, I have
experienced two major problems with this:

1. Su-8 developer is removing the unexposed Su-8 too quickly. Is there any
way to slow down the development (i.e. dilution)? I would like to avoid
excessive baking of the wafer.

2. As is widely known, when partially-developed Su-8 is rinsed with
isopropanol, a white residue results. Is there anything else to rinse the
developer (besides water) that will stop the development and not create the
white residue? Is there a different developer that I can use (i.e. ethyl
lactate, diacetone alcohol) that I can rinse away with out creating the
residue?

Thank you,
Evan