Hello MEMS Community, I would like to clean some fully processed wafers containing Al,0.5%Cu metal layers. What would be the best method to clean such wafers ? Normally, I use 90-100% HNO3 to clean my CMOS wafers with Al,1%Si metal layers. Can I apply the same cleaning solution for Al,0.5%Cu metal layers (or will this attack Cu and degrade the electrical characteristics of the metal layers) ? Any suggestion (based on experience) is deeply appreciated. Thanks in advance, Vijay -- Delft Institute of Microsystems & Nanoelectronics (DIMES) Delft University of Technology (TU Delft) The Netherlands