Hello everyone, I haven't seen this phenomenon but last couple of days 2 incidents have made me wonder about the cause. My wafer with 35um thick negative resist was peeled off as a sheet after develop. Anyone has any ideas of the causes? More info: the wafer was SB with 2mins/67C and 8mins/125C, exp and PEB at 5mins/90C then develop; the wafer was cleaned and hydrophilic before coating. Resist is BPR100. Thanks in advance for any hints. Regards, Paul