Hello,

I would like to bond a 5 mm by 5 mm Read out Integrated Circuit (ROIC)
to a 5 mm by 5 mm detector. I need to align both to within an accuracy
of 5 microns. I realise there are numerous techniques for wafer to wafer
level bonding however less so for single chip. I also realise that it is
likely that at present there is no such technology for such a process
however I thought I would ask this forum. You never know!!

If anyone has any experience in such a field or indeed has any ideas I
would love to hear them.

Many thanks!

--
Dr. James Paul Grant
Postdoctoral Research Associate
Microsystems Technology Group
74 Oakfield Avenue Room 5
University of Glasgow
Glasgow
Scotland
G12 8LS

Telephone: +44(0)141 330 6690