Hi Karolina,

Actually, I also plan to apply vapor phase HF etch for SiO2 release since I
got device damaging problem with wet HF etching. Currently I'm still keeping
with wet HF but working on different approaches. I heard from people, some
flip over SOI wafer upside down and hang it over concentrated HF. They use
this as alternative approach for vapor phase HF etching.

Li

--
Li. Zhang
---------
Graduate Student
Edward P. Fitts Department of Industrial and Systems Engineering
North Carolina State University
Raleigh, NC 27695-7906
USA
TEL: (919) 413-5459
Email: lzhang13@ncsu.edu
Web:  http://www.ise.ncsu.edu
         http://www.nnf.ncsu.edu