Dear all,

After dicing my bonded wafers (glass with Si) I found out that my
microchannels covered by glass wafer got partially stuffed up by dicing
dust. The problem is that I have openings on the cut face so there is no
possiblity to protect them from cooling wafer with dice dust.

My question is, is there any method to removed the trapped dicing dust
from microchannels covered by bonded chip? I tried ultrasonic-bath with
alcohol, but it dind't help much.

Thank you!

Regards

Natsuki