Hi All,

I am toying with the idea of using glass as a substrate for my application. I
was wondering if anyone has any insights into the challenges of doing this.

*         I will be spinning and baking polyimide PI2525.

*         I will then pattern photoresist AZ6632

*         Evaporate Ti/Au 10/100nm and then perform lift-off using NMP.

After some additional steps I would like to peel the polyimide with the device
of the glass substrate. I am assuming the polyimide glass interaction should be
the same as the polyimide SiO2 interaction. A few people have confirmed in
earlier posts that I can do this.

Thanks,


Darren Alvares
Graduate Student
Graduate School of Biomedical Engineering
University of New South Wales
UNSW Sydney NSW 2052 Australia
d.alvares@student.unsw.edu.au