Hi All-

We are processing PI-2545 on polished alumina substrates with a metal
pattern. After processing the PI we deposit and pattern a metal stack over
the PI. During the etching of this top layer there is lifting of the PI. No
PI lifting is visible prior to this. Most of this occurs in areas where the
PI is on the metal.

Any inputs to improve adhesion and eliminate peeling of the PI would be
highly appreciable. Thanking you.

Regards,

Sandeep