Hi,

Adhesion issues with Cu electroplating on Si is a major problem and we too
have faced it.

Fortunately we had rough Si surfaces on which Cu use to adhere well up to
60 um thick.

In your case, since you have SiO2, it would be a good choice if you can make the
Si
surface little rough then sputtered Cu and then elctroplate for less
thickness than what you are doing now.

best wishes

vikrant


> Hi everyone,
>
>        I'm working on Cu electroplating to fabricate Cu pad. The 200nm Cu
> seed layer is directly sputtered on the silicon dioxide without
> using adhesion layer. After about 4 um Cu is electroplated, the Cu
> is not adhered to the substrate well, and can peel off very easily.
> My question is, what kind of material can be used as the adhesion
> promotion layer. We have Al, Ti, Ag and Ni in our lab, and will
> these metals can act as the adhesion promotion layer? If not, what
> kind of material can be used and can be readily removed after the
> electroplating. Thanks.
>
> Joe


Vikrant A. Chaudhari
Research Scholar
Energy Systems Engg
Indian Institute of Technology Bombay
Mumbai-400076
India

Tele-+912225764888

www.ese.iitb.ac.in/~vikrant