Hi Everyone, I am working on forming thin film thermoelectrets with a system typically used for anodic or thermal compression bonding, think Suss or EVG bonder. I am not having any serious success according to the electrostatic volt meter. I have done a good amount of reading but I figure I am missing something basic. My main materials are PI-2611 and AF Teflon. These materials are spin cast on a Silicon wafer and solvent is baked out at 90C before loading between "dummy" wafers. I welcome comments and advice. Best Regards Mark Crain Cleanroom Manager & PhD Student University of Louisville mark.crain@louisville.edu