Hello,

Removal can be done in a O2 plasma (recipe: 60min 1000W 130°C)

Best regards,

Peter Kuijpers
MiPlaza Technology Laboratories
Philips Research Europe
High Tech Campus 04
Postbox HTC-4-1
5656 AE Eindhoven
The Netherlands
Tel.: +31 402743667
         +31 612507027
Email: p.e.m.kuijpers@philips.com


-----Original Message-----
From: mems-talk-bounces+p.e.m.kuijpers=philips.com@memsnet.org [mailto:mems-
talk-bounces+p.e.m.kuijpers=philips.com@memsnet.org] On Behalf Of Bhargav Nabar
Sent: Friday 1 October 2010 18:33
To: mems-talk@memsnet.org
Subject: Re: [mems-talk] AMMT KOH etch wafer holder

Thank you for your suggestion Mr Kuijpers. Could you please comment on ease
of removal of the parylene layer. What solvent do you use and does
it require any agitation (slow rotating or ultrasonic?). Also how was you
experience with the silicet clamp?

Thank you once again.
Bhargav Nabar
UT Arlington Nanofab