Dear Andrea,

Thanks for appreciating our work.

In wet anisotropic etching, it is hard to to get whole wafer surface completely
free of hillocks. Even in the echants which provide smooth etched surface
finish, some hillocks are observed. This we have mentioned in our work "Study of
rounded concave and sharp edge convex corners undercutting in CMOS compatible
anisotropic etchants”, Journal of Micromechanics and Microengineering, vol. 17,
no.11, pp. 2299-2307, November 2007.

In 25 wt% TMAH + 0.1 vol% Triton, the etched surface with 8-10 nm roughness can
be achieved easily if the etching is performed on cleaned wafer and in cleaned
solution as the wet etching characteristics are very sensitive impurities..

Best regards
Prem

On Sat, 09 Oct 2010 18:04:05 +0530  wrote
>Hi Prem,



i've read your paper "Complex three-dimensional structures in Si{1 0 0}
using wet bulk micromachining", really a nice job!

Just a question: which is the surface quality of (100) sufaces etched in
TMAH+Triton ? Is it possibile to achieve a (100) mirro-like surface ?

Best regards,

Andrea