Wondering if anyone has any experience anodic-bonding pyrex wafers to silicon wafers, where the pyrex is thicker than normal. For a 100mm wafer typical thicknesses I've worked with are in the 400-600um range. Has anyone had experience working with wafers 2 or 3 times thicker? Rob MacDonald Shearwater Scientific ------- original message ---- Hi Rob, I have anodic bonded Pyrex to silicon in up to a few mm thicknesses. Thickness of the Pyrex makes no discernible difference in the bond as long as the interface is at temperature. A simple hotplate bonder does not always suffice as the thermal insulation of the Pyrex makes the junction a bit colder. The two solutions are to bond Pyrex up and/or put a "tent" over the fixture to make it into a mini oven and block cooling air currents. The tent is a good idea even with silicon down as it makes the temperature across the glass more uniform and therefore reduces bonded in stress. Best, Dean (408) 429-0501