I suspect Ni with no adhesion layer would be problematic.  We've used Cr/Ni/Au
on crystalline Si.  Adhesion was fine, but there were some issues with wet
etching.

Dan Ruiz
MEMS Process Engineer
Honeywell International
15001 NE 36th street
Redmond, WA  98073-9701
Phone - 425-376-2167
dan.ruiz@honeywell.com

________________________________

From: mems-talk-bounces+dan.ruiz=honeywell.com@memsnet.org on behalf of Elina
Iervolino - EWI
Sent: Tue 11/16/10 9:05 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Au metallization for polysilicon



Hello,

We would like to use Ni/Cr/Au metallization as ohmic contact to
polysilicon. Does anyone know if this stack of layers provides good adhesion to
the polysilicon and prevent diffusion of the Au in the poly?

Any other suggestions?

thanks a lot

Elina Iervolino

PhD student
Delft University of Technology
Office Phone: +31 (0)15-2578040
Web page:www.xensor.nl