I have a wet release process where stiction is an issue. If the wafers,
which contain silicon bridge structures are dried in water, they will
stick to the substrate. No surprise there. Yesterday I noticed that if the
wafer is then immersed in DI after this, then some of the parts will
separate.

I'm wondering if any one has encountered this before? If so, what could
the mechanism be? One possibility is that the drying was incomplete. Also
possible is that there was some water soluble salt left in place after
drying which tended to cause more stiction.

Anyone have any ideas?