Hi,

If you want to remove SiO2 from the backside of the wafer,  the easyest is
to spin resist on te front side of your wafer for protection, then to etch
the backside in buffered HF and subsequently strip the resist from the front
side.

Cheers,

Ed

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*Edouard Duriau*|* ASML Netherlands BV *|* CS-ABS Imaging Systems*
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On Mon, Feb 14, 2011 at 11:52 AM, Babis  wrote:

> Hey, All
>
> I have recently purchased Thermal Oxide Si (Highly doped) wafers in order
> to prepare Organic TFT samples. However the wafers are double side deposited
> with SiO2. In order to make contact on the un-polished side, I suppose I
> have to etch SiO2. What methods do you propose for that purpose. Is there
> anything to watch out in order to achieve better results?
>
> Thank you in advance!