Several years ago I did some Si etching in a conventional CCP RIE system using SF6, O2 and CHF3. The etch rates were ~0.2-0.5um/min with depth up to ~30um. For more info look at papers on The Black Silicon Method by Henri Jansen. Roger Shile -----Original Message----- From: mems-talk-bounces+rshile=nanoink.net@memsnet.org [mailto:mems-talk-bounces+rshile=nanoink.net@memsnet.org] On Behalf Of Jonathan Abbott Sent: Tuesday, February 22, 2011 1:57 PM To: mems-talk@memsnet.org Subject: [mems-talk] DRIE with alternate chemistry Has anyone tried deep dry etching of silicon with something other that SF6 and seen good results? What chemistry did you use? Jonathan Abbott jdabbott@byu.net